166722-1 Datasheet PDF - TE Connectivity

●The AMPMODU MTE series Interconnection System is utilized in wire-to-board and wire-to-wire applications. The product implements insulation displacement contacts (IDC) or crimp snap-in contacts to suit customer"s needs. The coupling shrouds permit ganging of smaller receptacle and pin assemblies with guide ribs to form larger single or double row latching connectors.

● Swage option on posts provides retention in PC board

● High temperature option is SMT compatible