2212112-1 Datasheet PDF - TE Connectivity

●TE Connectivity"s next generation MULTI-BEAM card edge connectors deliver the best overall power and signal density to address server market requirements for performance, profile and cost. MULTI-BEAM card edge connectors are also applicable in global data communication applications to decrease costs. These products are the next generation card edge connectors over the current SEC-II power card edge products and deliver superior current and signal density with a unique design. The scalable and modular features also support greater flexibility in configuration and PCB design.

● Highest signal density in the market with 60% signal space savings (signal pitch 1.00mm, power pitch 7.26mm)

● The series provide better gatherability for blind-mate applications: +/-2.0mm (X), +/-1.54mm (Y) and supports two PCB thickness: 1.57mm and 2.36mm

● Current Rating: Power contact: up to 43A; Signal contact: up to 2A

● Voltage Rating: Power: 100V max.; Signal: 60V max.

● Mechanical shock and vibration resistant

● Low mating force: 6N max. per power contact; 1.5N max. per signal contact

● Durability: 200 mating cycles