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Part Datasheet Search > Heatsinks > Wakefield Engineering > 637-10ABP Datasheet PDF
637-10ABP
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637-10ABP Datasheet PDF (1 Pages)
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637-10ABP Specifications

TYPE
DESCRIPTION
Mounting Style
Through Hole
Case/Package
TO-220
Power Rating
6.00 W
Power Dissipation
6.00 W
Thermal Resistance
76 ℃/W
Thermal Resistance @ Forced Air Flow
5.80℃/W @200LFM

637-10ABP Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Not Recommended for New Design
Packaging
Bulk
Color
Black
Material
Aluminum
Size-Length
25.40 mm
Size-Width
34.9 mm
Size-Height
12.7 mm
Weight
10.43 g

637-10ABP Documents

Wakefield Engineering
1 Pages / 0.09 MByte
Wakefield Engineering
6 Pages / 0.47 MByte

63710 Documents

Wakefield Engineering
WAKEFIELD SOLUTIONS 637-10ABPE Heat Sink, Square, PCB, Black Anodized, Wave-Solderable, TO-220, 12.67℃/W, 25.4mm, 34.9mm
TE Connectivity
Mag-Mate Terminal 31-33AWG M 16mm 4.83mm Tin Strip
Wakefield Engineering
WAKEFIELD SOLUTIONS 637-10ABP Heat Sink, Square, Black Anodized, Wave-Solderable, TO-220, 76℃/W, 25.4mm, 34.9mm, 12.7mm
Wakefield Engineering
WAKEFIELD SOLUTIONS 637-10ABEP Heat Sink, For Board Level Power Semiconductor, TO-220, 5.8℃/W, 25.4mm, 34.9mm, 12.7mm
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