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658-25ABT1E Datasheet PDF - Wakefield Engineering

Manufacturer:

Wakefield Engineering

Category:

Heatsinks

Case Package:

BGA

Description:

658 Series 27.9 x 27.9 x 6.4mm 5° C/W Resistance Omnidirectional Heat Sink

Pictures:

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Product Pictures

Documentation:

658-25ABT1E Datasheet (1 Pages)658-25ABT1E User Reference Manual Guide (1 Pages)

658-25ABT1E Datasheet PDF (1 Pages)

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658-25ABT1E Specifications

TYPE

DESCRIPTION

Case/Package

BGA

Power Dissipation

2 W

Thermal Resistance

5 ℃/W

Thermal Resistance @ Forced Air Flow

5.00℃/W @500LFM

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658-25ABT1E Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Material

Aluminum

Size-Length

27.94 mm

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658-25ABT1E Environmental

658-25ABT1E Function Overview

658-25ABT1E Documents

658-25ABT1E Datasheet

Wakefield Engineering

1 Pages / 0.09 MByte

658-25ABT1E User Reference Manual Guide

Wakefield Engineering

1 Pages / 0.07 MByte

658-25ABT1E Other Datasheet PDF

Wakefield Engineering

2 Pages / 0.18 MByte

65825ABT1 Documents

658-25ABT1 Datasheet PDF

Wakefield Engineering

WAKEFIELD SOLUTIONS 658-25ABT1 Heat Sink, For Ball Grid Array, BGA, 6.4mm, 27.9mm, 27.9mm

658-25ABT1E Datasheet PDF

Wakefield Engineering

658 Series 27.9 x 27.9 x 6.4mm 5° C/W Resistance Omnidirectional Heat Sink

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