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658-25ABT4E Datasheet PDF - Wakefield Engineering

Manufacturer:

Wakefield Engineering

Category:

Heatsinks

Case Package:

BGA

Description:

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

658-25ABT4E Datasheet (1 Pages)658-25ABT4E User Reference Manual Guide (1 Pages)

658-25ABT4E Datasheet PDF (1 Pages)

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658-25ABT4E Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Case/Package

BGA

Thermal Resistance

5 ℃/W

Thermal Resistance @ Forced Air Flow

5℃/W @500LFM

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658-25ABT4E Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Bulk

Color

Black

Material

Aluminum

Size-Length

27.94 mm

Size-Width

27.9 mm

Size-Height

6.4 mm

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658-25ABT4E Environmental

658-25ABT4E Function Overview

658-25ABT4E Documents

658-25ABT4E Datasheet

Wakefield Engineering

1 Pages / 0.09 MByte

658-25ABT4E User Reference Manual Guide

Wakefield Engineering

1 Pages / 0.07 MByte

658-25ABT4E Other Datasheet PDF

Wakefield Engineering

20 Pages / 1.31 MByte

65825ABT4 Documents

658-25ABT4 Datasheet PDF

Wakefield Engineering

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

658-25ABT4E Datasheet PDF

Wakefield Engineering

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

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