90136-1208 Datasheet PDF - Molex

●C-Grid III™

●Post and receptacle interconnection system offering complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The 3rd generation C-Grid III 2.54mm pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features:

●Surface Treatment: C-Grid III is available in 3 standard platings. Two performance levels of selective Gold and one of Tin, all over a Nickel-plated substrate, guarantee the optimum ration of quality versus cost of your application.

●Flexibility: C-Grid III has been developed to meet the latest industry requirements. Three different termination techniques, solder tail, crimp, and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.

●Advantage by Design: C-Grid III box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.

●Interchangeability: C-Grid III is fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14. Moreover, it is fully intermateable/interchangeable with Molex"s QF-50 product range.

●Lower Applied Cost: C-Grid III system incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines. C-Grid III offers the widest range of interconnection packaging alternatives in the electric market today.