●Product Details
●The AD7981 is a 16-bit, successive approximation, PulSAR® analog-to-digital converter (ADC) designed for high temperature operation. The AD7981 is capable of sample rates of up to 600 kSPS while maintaining low power consumption from a single power supply, VDD. It is a fast throughput, high accuracy, high temperature,successive approximation register (SAR) ADC, packaged in a small form factor with a versatile serial port interface (SPI).
●On the CNV rising edge, the AD7981 samples an analog input, IN+, between 0 V and REF with respect to a ground sense, IN−. The reference voltage, REF, is applied externally and can be set independent of the supply voltage, VDD. The device power scales linearly with throughput.
●The SPI-compatible serial interface also features the ability, using the SDI input, to daisy-chain several ADCs on a single, 3-wire bus and provides an optional busy indicator. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic, using the separate supply, VIO.
●For space constrained applications, the AD7981 is available in a 10-lead mini small outline package (MSOP) with operation specified from −55°C to +175°C and 10-lead ceramic flat package (FLATPACK) with operation specified from −55°C to +210°C. These packages are designed for robustness at extreme temperatures, including monometallic wire bonding, and are qualified for up to 1000 hours of operation at the maximum temperature rating.
●The AD7981 is a member of a growing series of high temperature qualified products offered by Analog Devices, Inc. For a complete selection of available high temperature products, see the high temperature product list and qualification data available at www.analog.com/hightemp.
●Applications
● Downhole drilling and instrumentation
● Avionics
● Heavy industrial
● High temperature environments
●### Features and Benefits
● Extreme high temperature operation
● Specified temperature range
● −55°C to +210°C (10-lead FLATPACK)
● −55°C to +175°C (10-Lead MSOP)
● High performance
● 16-bit resolution with no missing codes
● 600 kSPS throughput with no latency/pipeline delay
● SNR: 91 dB typical at 1 kHz input frequency
● THD: −102 dB typical at 1 kHz input frequency
● INL: ±2.5 LSB maximum, DNL: ±0.9 LSB maximum
● Low power
● 2.25 mW typical at 600 kSPS (VDD only)
● 4.65 mW typical at 600 kSPS (total)
● 75 µW typical at 10 kSPS
● Small footprint
● 10-lead, 3 mm × 3 mm, monometallic wire bonding MSOP
● 10-lead, 0.255 mm × 0.255 mm, monometallic wire bonding FLATPACK
● Pseudo differential analog input range
● 0 V to VREF with VREF between 2.4 V and 5.1 V
● Single-supply 2.5 V operation with 1.8 V to 5 V logic interface
● SPI-/QSPI-/MICROWIRE-/DSP-compatible digital interface
● Daisy-chain multiple ADCs and busy indicator
Part 3D Model
