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APT75GN60SDQ2G Datasheet PDF - Microsemi

Manufacturer:

Microsemi

Case Package:

TO-268

Description:

Trans IGBT Chip N-CH 600V 155A 536000mW 3Pin(2+Tab) D3PAK

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

APT75GN60SDQ2G Datasheet (9 Pages)APT75GN60SDQ2G User Reference Manual Guide (12 Pages)

APT75GN60SDQ2G Specifications

TYPE

DESCRIPTION

Number of Pins

3 Pin

Case/Package

TO-268

Power Dissipation

536000 mW

Operating Temperature (Max)

175 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

536000 mW

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APT75GN60SDQ2G Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tube

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APT75GN60SDQ2G Environmental

APT75GN60SDQ2G Export Classifications

APT75GN60SDQ2G Documents

APT75GN60SDQ2G Datasheet

Microsemi

9 Pages / 0.2 MByte

APT75GN60SDQ2G User Reference Manual Guide

Microsemi

12 Pages / 1.03 MByte

APT75GN60SDQ2G Other Datasheet PDF

Microsemi

5 Pages / 0.23 MByte

APT75GN60SDQ2 Documents

APT75GN60SDQ2G Datasheet PDF

Microsemi

Trans IGBT Chip N-CH 600V 155A 536000mW 3Pin(2+Tab) D3PAK

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