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B30931D7020Y918 Datasheet PDF - TDK

Manufacturer:

TDK

Category:

RF Modules,ICs & Accessories

Case Package:

BGA

Description:

Wireless Module 168Pin LGA

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

B30931D7020Y918 Datasheet (51 Pages)

B30931D7020Y918 Specifications

TYPE

DESCRIPTION

Number of Pins

168 Pin

Case/Package

BGA

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

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B30931D7020Y918 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Obsolete

Packaging

Tape & Reel (TR)

Size-Height

1.35 mm

Operating Temperature

-40℃ ~ 85℃

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B30931D7020Y918 Environmental

B30931D7020Y918 Documents

B30931D7020Y918 Datasheet

TDK

51 Pages / 1.67 MByte

B30931D7020 Documents

B30931D7020Y918 Datasheet PDF

Epcos

Wireless Module 168Pin LGA T/R

B30931D7020Y918 Datasheet PDF

TDK-EPC

Wireless Module 168Pin LGA T/R

B30931D7020Y918 Datasheet PDF

TDK

Wireless Module 168Pin LGA

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