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B82422T3120K000 Datasheet PDF - TDK

Manufacturer:

TDK

Case Package:

1210

Description:

1210 12nH ±10% 450mA

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Documentation:

B82422T3120K000 Datasheet (10 Pages)

B82422T3120K000 Datasheet PDF (10 Pages)

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B82422T3120K000 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Current Rating

450 mA

Case/Package

1210

Inductance

12 nH

Q-Factor

Inductance Tolerance

±10 %

DC Resistance (DCR)

110 mΩ

Resistance (DC Max)

320 mΩ

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B82422T3120K000 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

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B82422T3120K000 Environmental

B82422T3120K000 Function Overview

B82422T3120K000 Documents

B82422T3120K000 Datasheet

TDK

10 Pages / 0.49 MByte

B82422T3120 Documents

B82422T3120K000 Datasheet PDF

Epcos

Fixed Ind 12nH 450mA 110Mohm

B82422T3120K Datasheet PDF

Epcos

Inductor General Purpose Chip Molded Wirewound 12nH 10% 100MHz 17Q-Factor Ceramic 450mA 110mOhm DCR 1210 Automotive T/R

B82422T3120J Datasheet PDF

Epcos

Inductor General Purpose Chip Molded Wirewound 12nH 5% 100MHz 17Q-Factor Ceramic 450mA 110mOhm DCR 1210 Automotive T/R

B82422T3120K Datasheet PDF

TDK

Ind General Purpose Chip Molded Wirewound 12nH 10% 100MHz 17Q-Factor Ceramic 450mA 1210 Blister T/R

B82422T3120J000 Datasheet PDF

Epcos

Fixed Ind 12nH 450mA 110Mohm

B82422T3120K000 Datasheet PDF

TDK

1210 12nH ±10% 450mA

B82422T3120J Datasheet PDF

TDK

Ind General Purpose Chip Molded Wirewound 12nH 5% 100MHz 17Q-Factor Ceramic 450mA 1210 Blister T/R

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