Part 3D Model

$ 0.214

B82422T3680K000 Datasheet PDF - TDK

Manufacturer:

TDK

Category:

Inductor Surface Mount

Case Package:

1210

Description:

1210 68nH ±10% 450mA

Pictures:

3D Model

Symbol

Footprint

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Product Pictures

Documentation:

B82422T3680K000 Datasheet (9 Pages)

Package Outline Dimension on3 Page

Part Numbering System on5 Page 6 Page

B82422T3680K000 Datasheet PDF (9 Pages)

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B82422T3680K000 Specifications

TYPE

DESCRIPTION

Current Rating

450 mA

Case/Package (SI)

3225

Case/Package

1210

Inductance

68 nH

Q-Factor

Inductance Tolerance

±10 %

Test Frequency

100 MHz

DC Resistance (DCR)

230 mΩ

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B82422T3680K000 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Size-Length

3.2 mm

Size-Width

2.5 mm

View Datasheet >

B82422T3680K000 Environmental

B82422T3680K000 Function Overview

B82422T3680K000 Documents

B82422T3680K000 Datasheet

TDK

9 Pages / 0.48 MByte

B82422T3680 Documents

B82422T3680K Datasheet PDF

Epcos

Inductor General Purpose Chip Molded Wirewound 68nH 10% 100MHz 27Q-Factor Ceramic 450mA 230mOhm DCR 1210 Automotive T/R

B82422T3680K000 Datasheet PDF

Epcos

Ind General Purpose Chip Molded Wirewound 68nH 10% 100MHz 27Q-Factor Ceramic 450mA 3.2 x 2.5mm Blister T/R

B82422T3680J Datasheet PDF

Epcos

Inductor General Purpose Chip Molded Wirewound 68nH 5% 100MHz 27Q-Factor Ceramic 450mA 230mOhm DCR 1210 Automotive T/R

B82422T3680K000 Datasheet PDF

TDK

1210 68nH ±10% 450mA

B82422T3680J000 Datasheet PDF

Epcos

Fixed Ind 68nH 450mA 230Mohm

B82422T3680K Datasheet PDF

TDK

Ind General Purpose Chip Molded Wirewound 68nH 10% 100MHz 27Q-Factor Ceramic 450mA 1210 Blister T/R

B82422T3680J Datasheet PDF

TDK

Ind General Purpose Chip Molded 68nH 5% 100MHz 27Q-Factor Ceramic 450mA 1210 Blister T/R

B82422-T3680-J Datasheet PDF

TDK

Ind 68nH 5% 100MHz 27Q-Factor Ceramic 450mA 1210 Blister T/R

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