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Part Datasheet Search > TDK-EPC > B82498F3689K000 Datasheet PDF
B82498F3689K000
Part 3D Model
$ 0.273
B82498F3689K000 Datasheet PDF (10 Pages)
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B82498F3689K000 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Current Rating
800 mA
Capacitance Tolerance
±10 %
Case/Package
0805
Inductance
0.0068 µH
Self Resonant Frequency
6 GHz
DC Resistance (DCR)
≤50 mΩ
Operating Temperature (Max)
125 ℃
Operating Temperature (Min)
-55 ℃
Resistance (DC Max)
0.05 Ω

B82498F3689K000 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Size-Height
1.4 mm
Operating Temperature
-55℃ ~ 125℃

B82498F3689K000 Documents

TDK-EPC
10 Pages / 0.48 MByte
TDK-EPC
1 Pages / 0.14 MByte

B82498F3689 Documents

Epcos
Inductor Chip Molded Wirewound 6.8nH 10% 250MHz 50Q-Factor Ceramic 800mA 50mOhm DCR 0805 Blister T/R
Epcos
Inductor Chip Molded Wirewound 6.8nH 10% 250MHz 50Q-Factor Ceramic 800mA 50mOhm DCR 0805 Blister T/R
TDK
0805 6.8nH ±5% 800mA
TDK
0805 6.8nH ±10% 800mA
Epcos
RF Inductors SMT-INDUCTOR 0805 6.8nH 5%
TDK
0805 6.8nH ±10% 800mA
Epcos
Inductor Chip Molded Wirewound 6.8nH 10% 250MHz 50Q-Factor Ceramic 800mA 50mOhm DCR 0805 Automotive T/R
TDK-EPC
FIXED IND 6.8nH 800mA 50MOHM
TDK
Inductor Chip Molded Wirewound 6.8nH 10% 250MHz 50Q-Factor Ceramic 800mA 50mOhm DCR 0805 Automotive T/R
Epcos
Inductor Chip Molded Wirewound 6.8nH 5% 250MHz 50Q-Factor Ceramic 800mA 50mOhm DCR 0805 Automotive T/R
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