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BD1HC500EFJ-CE2 Datasheet PDF - ROHM Semiconductor

Manufacturer:

ROHM Semiconductor

Category:

Hot Swap & Power Distribution

Case Package:

HTSOP-8

Description:

ROHM BD1HC500EFJ-CE2 Power Load Distribution Switch IC, High Side, 1 Output, 18V in, 1.45A, 0.5Ω, HTSOP-8 New

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Documentation:

BD1HC500EFJ-CE2 Datasheet (21 Pages)

Pinout Diagram on2 PageHot

Package Outline Dimension on14 Page

Part Numbering System on13 Page

BD1HC500EFJ-CE2 Datasheet PDF (21 Pages)

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BD1HC500EFJ-CE2 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

8 Pin

Case/Package

HTSOP-8

Number of Outputs

1 Output

Input Voltage (DC)

18.0 V

Output Current

800 mA

Number of Positions

8 Position

Output Current (Max)

3 mA

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-40 ℃

Input Voltage

18 V

View Datasheet >

BD1HC500EFJ-CE2 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Cut Tape (CT)

Operating Temperature

-40℃ ~ 150℃ (TJ)

View Datasheet >

BD1HC500EFJ-CE2 Environmental

BD1HC500EFJ-CE2 Function Overview

BD1HC500EFJ-CE2 Documents

BD1HC500EFJ-CE2 Datasheet

ROHM Semiconductor

21 Pages / 0.8 MByte

BD1HC500EFJ-CE2 Other Datasheet PDF

ROHM Semiconductor

9 Pages / 2.28 MByte

BD1HC500EFJ-CE2 Notice File

ROHM Semiconductor

6 Pages / 0.74 MByte

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