BUL54AFI Datasheet PDF - Semelab

●• SEMEFAB DESIGNED AND DIFFUSED DIE

●• HIGH VOLTAGE

●• FAST SWITCHING

●• HIGH ENERGY RATING

●• MILITARY AND HI–REL VERSIONS AVAILABLE IN METAL AND CERAMIC SURFACE MOUNT PACKAGES

●FEATURES

●• Multi–base for efficient energy distribution across the chip resulting in significantly improved switching and energy ratings across full temperature range.

●• Ion implant and high accuracy masking for tight control of characteristics from batch to batch.

●• Triple Guard Rings for improved control of high voltages.