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CSD86311W1723 Datasheet PDF - TI

Manufacturer:

Category:

MOSFETs

Case Package:

UFBGA-12

Description:

Wafer N-CH 25V 4.5A

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

CSD86311W1723 Datasheet (10 Pages)

Package Outline Dimension on6 Page 8 Page 9 Page

Package Footprint Pad Layout on7 Page

Part Numbering System on1 Page

CSD86311W1723 User Reference Manual Guide (31 Pages)

CSD86311W1723 Datasheet PDF (10 Pages)

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CSD86311W1723 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

12 Pin

Case/Package

UFBGA-12

Number of Positions

12 Position

Drain to Source Resistance (on) (Rds)

0.029 Ω

Polarity

Dual N-Channel

Power Dissipation

1.5 W

Threshold Voltage

1 V

Drain to Source Voltage (Vds)

25 V

Continuous Drain Current (Ids)

4.5A

Rise Time

4.3 ns

Input Capacitance (Ciss)

585pF @12.5V(Vds)

Input Power (Max)

1.5 W

Fall Time

2.9 ns

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

1500 mW

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CSD86311W1723 Size & Package

TYPE

DESCRIPTION

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 150℃ (TJ)

View Datasheet >

CSD86311W1723 Environmental

CSD86311W1723 Function Overview

CSD86311W1723 Documents

CSD86311W1723 Datasheet

10 Pages / 0.84 MByte

CSD86311W1723 User Reference Manual Guide

31 Pages / 0.79 MByte

CSD86311 Documents

CSD86311W1723 Datasheet PDF

Wafer N-CH 25V 4.5A

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