Part 3D Model

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CY7C1165KV18-550BZXC Datasheet PDF - Cypress Semiconductor

Manufacturer:

Cypress Semiconductor

Category:

Memory Chip

Case Package:

FBGA-165

Description:

SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165Pin FBGA Tray

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CY7C1165KV18-550BZXC Datasheet PDF (30 Pages)

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CY7C1165KV18-550BZXC Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

165 Pin

Case/Package

FBGA-165

Number of Bits

36 Bit

Access Time(Max)

0.45 ns

Operating Temperature (Max)

70 ℃

Operating Temperature (Min)

0 ℃

Supply Voltage

1.7V ~ 1.9V

CY7C1165KV18-550BZXC Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Unknown

Packaging

Tray

Operating Temperature

0℃ ~ 70℃

CY7C1165KV18-550BZXC Environmental

CY7C1165KV18-550BZXC Export Classifications

CY7C1165KV18-550BZXC Function Overview

CY7C1165KV18-550BZXC Documents

CY7C1165KV18-550BZXC Other Datasheet PDF

Cypress Semiconductor

30 Pages / 0.85 MByte

CY7C1165KV18550 Documents

CY7C1165KV18-550BZC Datasheet PDF

Cypress Semiconductor

SRAM Chip Sync Dual 1.8V 18M-bit 512K x 36 0.45ns 165Pin FBGA Tray

CY7C1165KV18-550BZXC Datasheet PDF

Cypress Semiconductor

SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165Pin FBGA Tray

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