●The XS™ DrMOS family is Fairchild’s next-generation fullyoptimized, ultra-compact, integrated MOSFET plus driver power stage solutions for high current, high frequency synchronous buck DC-DC applications. The FDMF6704 XS™ DrMOS integrates a driver IC, two power MOSFETs and a bootstrap Schottky diode into a thermally enhanced, ultra compact 6 mm x 6 mm MLP package. With an integrated approach, the complete switching power stage is optimized with regards to driver and MOSFET dynamic performance, system inductance and R. This greatly reduces the package parasitics and layout challenges associated with conventional discrete solutions. XS™ DrMOS uses Fairchild"s high performance PowerTrench™ 5 MOSFET technology, which dramatically reduces ringing in synchronous buck converter applications. PowerTrench™ 5 can eliminate the need for a snubber circuit in buck converter applications. The driver IC incorporates advanced features such as SMOD for improved light load efficiency and a Tri-State PWM input for compatibility with a wide range of PWM controllers. A 5 V gate drive and an improved PCB interface optimized for a maximum low side FET exposed pad area, ensure higher performance. This product is compatible with the new Intel 6 mm x 6 mm DrMOS specification.
●Features
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● Ultra- compact thermally enhanced 6 mm x 6 mm MLPpackage 84 % smaller than conventional discrete solutions.
● Synchronous driver plus FET multichip module.
● High current handling of 35 A.
● Over 93 % peak efficiency.
● Tri-State PWM input.
● Fairchild"s PowerTrench® 5 technology MOSFETs for cleanvoltage waveforms and reduced ringing.
● Optimized for high switching frequencies of up to 1 MHz.
● Skip mode SMOD [low side gate turn off] input.
● Fairchild SyncFET™ [integrated Schottky diode] technologyin the low side MOSFET.
● Integrated bootstrap Schottky diode.
● Adaptive gate drive timing for shoot-through protection.
● Driver output disable function [DISB# pin].
● Undervoltage lockout (UVLO).
● Fairchild Green Packaging and RoHScompliant. Low profile SMD package.
Part 3D Model
