$ 925.083

FF1800R17IP5PBPSA1 Datasheet PDF - Infineon

Manufacturer:

Infineon

Case Package:

AG-PRIME3

Description:

1700V PrimePACK™3+ dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material.

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

FF1800R17IP5PBPSA1 Datasheet (10 Pages)FF1800R17IP5PBPSA1 User Reference Manual Guide (36 Pages)FF1800R17IP5PBPSA1 Application Note (40 Pages)

FF1800R17IP5PBPSA1 Specifications

TYPE

DESCRIPTION

Case/Package

AG-PRIME3

Breakdown Voltage (Collector to Emitter)

1700 V

Input Capacitance (Cies)

105nF @25V

Input Power (Max)

1800000 W

View Datasheet >

FF1800R17IP5PBPSA1 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-40℃ ~ 175℃

View Datasheet >

FF1800R17IP5PBPSA1 Environmental

FF1800R17IP5PBPSA1 Function Overview

FF1800R17IP5PBPSA1 Documents

FF1800R17IP5PBPSA1 Datasheet

Infineon

10 Pages / 0.89 MByte

FF1800R17IP5PBPSA1 User Reference Manual Guide

Infineon

36 Pages / 3.45 MByte

FF1800R17IP5PBPSA1 Other Datasheet PDF

Infineon

73 Pages / 2.93 MByte

FF1800R17IP5PBPSA1 Application Note

Infineon

40 Pages / 6.73 MByte

FF1800R17IP5PBPSA1 Packaging

Infineon

8 Pages / 0.88 MByte

FF1800R17IP5 Documents

FF1800R17IP5 Datasheet PDF

Infineon

Trans IGBT Module N-CH 1.7kV 1800A 14Pin PRIME3

FF1800R17IP5BPSA1 Datasheet PDF

Infineon

1700V PrimePACK™3+ dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC.

FF1800R17IP5PBPSA1 Datasheet PDF

Infineon

1700V PrimePACK™3+ dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material.

FF1800R17IP5P Datasheet PDF

Infineon

1700V PrimePACK™3+ dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material.