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Part Datasheet Search > Infineon > FF900R12IE4BOSA1 Datasheet PDF
FF900R12IE4BOSA1
$ 0.326
FF900R12IE4BOSA1 Datasheet PDF (9 Pages)
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FF900R12IE4BOSA1 Specifications

TYPE
DESCRIPTION
Number of Pins
10 Pin
Case/Package
AG-PRIME2-1
Power Dissipation
5.1 kW
Breakdown Voltage (Collector to Emitter)
1200 V
Input Capacitance (Cies)
54nF @25V
Input Power (Max)
5100 W
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-40 ℃
Power Dissipation (Max)
5100000 mW

FF900R12IE4BOSA1 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tray
Size-Length
172 mm
Size-Width
89 mm
Size-Height
38 mm
Operating Temperature
-40℃ ~ 150℃ (TJ)

FF900R12IE4BOSA1 Documents

Infineon
9 Pages / 1.7 MByte
Infineon
36 Pages / 3.45 MByte
Infineon
73 Pages / 2.93 MByte
Infineon
40 Pages / 6.73 MByte
Infineon
7 Pages / 0.25 MByte

FF900R12IE4 Documents

Infineon
Trans IGBT Module N-CH 1200V 900A 5100000mW 10Pin PRIME2-1 Tray
Infineon
Trans IGBT Module N-CH 1200V 900A 5100000mW 10Pin PRIME2-1 Tray
Infineon
1200V PrimePACK™ 2 dual IGBT module especially developed for CAV applications. Including Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC.
Infineon
1200V PrimePACK™ 2 dual IGBT module especially developed for CAV applications. Including Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC.
Infineon
1200V PrimePACK™ 2 dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material.
Infineon
1200V PrimePACK™ 2 dual IGBT module especially developed for CAV applications. Including Trench/Fieldstop IGBT4, Emitter Controlled 4 diode NTC and pre-applied Thermal Interface Material.
Infineon
1200V PrimePACK™ 2 dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material.
Infineon
1200V PrimePACK™ 2 dual IGBT module especially developed for CAV applications. Including Trench/Fieldstop IGBT4, Emitter Controlled 4 diode NTC and pre-applied Thermal Interface Material.
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