IPN60R360P7S Datasheet PDF - Infineon

●Description:

●CoolMOS™ P7 is designed to address typical challenges in the low power SMPS market, by offering excellent performance and ease-of-use, enabling improved form factors and price competitiveness. The SOT-223 package is a cost effective one-to-one drop-in alternative to DPAK that also enables footprint reduction in some designs. It can be placed on a typical DPAK footprint and shows comparable thermal performance. This combination makes CoolMOS™ P7 in SOT-223 a perfect fit for its target applications.

●700V and 800V CoolMOS™ P7 are optimized for flyback topologies. 600V CoolMOS™ P7 is suitable for hard as well as so switching topologies (Flyback, PFC and LLC).

●Summary of Features:

●Best-fit performance superjunction technology

● Enabling lower MOSFET chip temperature

● Leading to higher e iciency comparedto previous technologies

● Allowing improved form factors and slim designs

●Cost-effective package solution

● Drop-in replacement for DPAK atcompetitive cost

● Space savings in designs with lowpower dissipation; enabling smaller form factors

● Comparable thermal behavior to DPAK

●Best-in-class price/performance ratio

● Attractive price position for high performance technology