Part 3D Model

$ 0.026

MMZ1608Q331BTD25 Datasheet PDF - TDK

Manufacturer:

TDK

Category:

EMI/RFI Shielding/Suppression

Case Package:

0603

Description:

Ind Chip Bead 330Ω 25% 100MHz Ferrite 400mA 0603 Punched Paper T/R

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3D Model

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Documentation:

MMZ1608Q331BTD25 Datasheet (15 Pages)

Part Numbering System on3 Page

MMZ1608Q331BTD25 Datasheet PDF (15 Pages)

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MMZ1608Q331BTD25 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Case/Package

0603

Test Frequency

100 MHz

Current Rating (Max)

400 mA

Operating Temperature (Max)

125 ℃

Operating Temperature (Min)

-55 ℃

Resistance (DC Max)

500 mΩ

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MMZ1608Q331BTD25 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Width

0.8 mm

Size-Height

0.95 mm

Operating Temperature

-55℃ ~ 125℃

Minimum Packing Quantity

4000

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MMZ1608Q331BTD25 Environmental

MMZ1608Q331BTD25 Function Overview

MMZ1608Q331BTD25 Documents

MMZ1608Q331BTD25 Datasheet

TDK

15 Pages / 0.41 MByte

MMZ1608Q331BTD25 Other Datasheet PDF

TDK

15 Pages / 0.41 MByte

MMZ1608Q331 Documents

MMZ1608Q331BTA00 Datasheet PDF

TDK

Ferrite Beads Multi-Layer 330Ω 25% 100MHz 400mA 500mOhm DCR 0603

MMZ1608Q331BTD25 Datasheet PDF

TDK

Ind Chip Bead 330Ω 25% 100MHz Ferrite 400mA 0603 Punched Paper T/R

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