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MSP430G2252TDA2 Datasheet PDF - TI

Manufacturer:

Category:

Microcontrollers

Case Package:

DIE

Description:

MCU 16Bit MSP430 MSP430 RISC Flash 2.5V/3.3V 22Pin Die Waffle

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3D Model

Symbol

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Product Pictures

Documentation:

MSP430G2252TDA2 Datasheet (6 Pages)

Package Outline Dimension on4 Page

Part Numbering System on2 Page

MSP430G2252TDA2 Datasheet PDF (6 Pages)

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MSP430G2252TDA2 Specifications

TYPE

DESCRIPTION

Number of Pins

22 Pin

Case/Package

DIE

RAM Memory Size

256 x 8

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MSP430G2252TDA2 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tube

Operating Temperature

-40℃ ~ 85℃ (TA)

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MSP430G2252TDA2 Environmental

MSP430G2252TDA2 Function Overview

MSP430G2252TDA2 Documents

MSP430G2252TDA2 Datasheet

6 Pages / 0.1 MByte

MSP430G2252 Documents

MSP430G2252 Datasheet PDF

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MSP430G2252IN20 Datasheet PDF

TEXAS INSTRUMENTS MSP430G2252IN20 16Bit Microcontroller, Mixed Signal, MSP430G2xx, 16MHz, 2KB, 256Byte, 20Pins, DIP

MSP430G2252IPW20 Datasheet PDF

MCU 16Bit MSP430 RISC 2KB Flash 2.5V/3.3V 20Pin TSSOP

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MSP430G2252IRSA16R Datasheet PDF

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MSP430G2252IPW20R Datasheet PDF

MCU 16Bit MSP430 RISC 2KB Flash 2.5V/3.3V 20Pin TSSOP T/R

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MSP430G2252TDA2 Datasheet PDF

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MSP430G2252TDA1 Datasheet PDF

MCU 16Bit MSP430 MSP430 RISC Flash 2.5V/3.3V 22Pin Die Waffle

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