●These octal transparent D-type latches are designed for 2.7-V to 5.5-V VCC operation.
●The "LV573 feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
●While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
●A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.
●does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
●The SN74LV573 is available in TI"s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
●The SN54LV573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LV573 is characterized for operation from -40°C to 85°C.
● EPICTM (Enhanced-Performance Implanted CMOS) 2-u Process
● Typical VOLP (Output Ground Bounce) < 0.8 V at VCC, TA = 25°C
● Typical VOHV (Output VOH Undershoot) > 2 V at VCC, TA = 25°C
● ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Latch-Up Performance Exceeds 250 mA
●Per JEDEC Standard JESD-17
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), Ceramic Flat (W) Packages, Chip Carriers (FK), and (J) 300-mil DIPs
●EPIC is a trademark of Texas Instruments Incorporated.
Part 3D Model
