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$ 29.149

SPC5775EDK3MME3 Datasheet PDF - NXP

Manufacturer:

NXP

Case Package:

BGA

Description:

MCU 32-bit e200z7 RISC 4MB Flash 5V 416-Pin MAP-BGA Tray

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SPC5775EDK3MME3 Datasheet PDF

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SPC5775EDK3MME3 Specifications

TYPE

DESCRIPTION

Number of Pins

416 Pin

Case/Package

BGA

Number of Positions

416 Position

RAM Memory Size

512 KB

Power Dissipation

1600 mW

Number of ADCs

2 ADC

Number of Inputs and Outputs

293 Input

Operating Temperature (Max)

125 ℃

Operating Temperature (Min)

-40 ℃

Power Dissipation (Max)

1600 mW

Supply Voltage (Max)

5.5 V

Supply Voltage (Min)

4.5 V

SPC5775EDK3MME3 Size & Package

TYPE

DESCRIPTION

Packaging

Tray

SPC5775EDK3MME3 Environmental

SPC5775EDK3MME3 Documents

SPC5775EDK3MME3 Notice File

NXP

3 Pages / 0.04 MByte

SPC5775EDK3 Documents

SPC5775EDK3MME3 Datasheet PDF

NXP

MCU 32-bit e200z7 RISC 4MB Flash 5V 416-Pin MAP-BGA Tray

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