SS32-E3/57T Datasheet PDF - General Semiconductor

●Features:

● Low Profile Package

● Ideal for Automated Placement

● Guardring for Overvoltage Protection

● Low Power Losses, High Efficiency

● Very Low Forward Voltage Drop

● High Surge Capability

● Meets MSL Level 1, Per J-STD-020, LF Maximum Peak of 260°C

● Solder Dip 260°C, 40 s

● Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

●Applications:

●For use in low voltage high frequency inverters, freewheeling, DC-to-DC converters, and polarity protection applications.