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STGB6NC60HDT4 Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 15A 62500mW 3Pin(2+Tab) D2PAK T/R

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Documentation:

STGB6NC60HDT4 Datasheet (18 Pages)

Package Outline Dimension on11 Page 12 Page 13 Page 14 Page 15 Page

STGB6NC60HDT4 Datasheet PDF (18 Pages)

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STGB6NC60HDT4 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Voltage Rating (DC)

600 V

Current Rating

15.0 A

Case/Package

TO-263-3

Polarity

N-Channel

Power Dissipation

62500 mW

Rise Time

5.00 ns

Breakdown Voltage (Collector to Emitter)

600 V

Reverse recovery time

21 ns

Input Power (Max)

56 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

62500 mW

View Datasheet >

STGB6NC60HDT4 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Width

9.35 mm

Operating Temperature

-55℃ ~ 150℃ (TJ)

View Datasheet >

STGB6NC60HDT4 Environmental

STGB6NC60HDT4 Export Classifications

STGB6NC60HDT4 Function Overview

STGB6NC60HDT4 Documents

STGB6NC60HDT4 Datasheet

ST Microelectronics

18 Pages / 0.4 MByte

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