● High-Performance Static CMOS Technology
● Up to 150 MHz (6.67-ns Cycle Time)
● 1.9-V/1.8-V Core, 3.3-V I/O Design
● High-Performance 32-Bit CPU (TMS320C28x)
● IEEE-754 Single-Precision Floating-Point Unit (FPU) (F2833x only)
● 16 x 16 and 32 x 32 MAC Operations
● 16 x 16 Dual MAC
● Harvard Bus Architecture
● Fast Interrupt Response and Processing
● Unified Memory Programming Model
● Code-Efficient (in C/C++ and Assembly)
● Six-Channel DMA Controller (for ADC, McBSP,ePWM, XINTF, and SARAM)
● 16-Bit or 32-Bit External Interface (XINTF)
● Over 2M x 16 Address Reach
● On-Chip Memory
● F28335, F28235: 256K x 16 Flash, 34K x 16 SARAM
● F28334, F28234: 128K x 16 Flash, 34K x 16 SARAM
● F28332, F28232: 64K x 16 Flash, 26K x 16 SARAM
● 1K x 16 OTP ROM
● Boot ROM (8K x 16)
● With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
● Standard Math Tables
● Clock and System Control
● Dynamic PLL Ratio Changes Supported
● On-Chip Oscillator
● Watchdog Timer Module
● GPIO0 to GPIO63 Pins Can Be Connected to One of the EightExternal Core Interrupts
● Peripheral Interrupt Expansion (PIE) Block That Supports All58Peripheral Interrupts
● 128-Bit Security Key/Lock
● Protects Flash/OTP/RAM Blocks
● Prevents Firmware Reverse Engineering
● EnhancedControl Peripherals
● Up to 18 PWM Outputs
● Up to 6 HRPWM Outputs With 150 ps MEP Resolution
● Up to 6 Event Capture Inputs
● Up to 2 Quadrature Encoder Interfaces
● Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs)
● Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs)
● Three 32-Bit CPU Timers
● Serial Port Peripherals
● Up to 2 CAN Modules
● Up to 3 SCI (UART) Modules
● Up to 2 McBSP Modules (Configurable as SPI)
● One SPI Module
● One Inter-Integrated-Circuit (I2C) Bus
● 12-Bit ADC, 16 Channels
● 80-ns Conversion Rate
● 2 x 8 Channel Input Multiplexer
● Two Sample-and-Hold
● Single/Simultaneous Conversions
● Internal or External Reference
● Up to 88 Individually Programmable, Multiplexed GPIO Pins WithInput Filtering
● JTAG Boundary Scan Support
● Advanced Emulation Features
● Analysis and Breakpoint Functions
● Real-Time Debug via Hardware
● Development Support Includes
● ANSI C/C++ Compiler/Assembler/Linker
● Code Composer Studio IDE
● DSP/BIOS
● Digital Motor Control and Digital Power Software Libraries
● Low-Power Modes and Power Savings
● IDLE, STANDBY, HALT Modes Supported
● Disable Individual Peripheral Clocks
● Endianness: Little Endian
● Package Options:
● Lead-free, Green Packaging
● Low-Profile Quad Flatpack (PGF, PTP)
● MicroStar BGA (ZHH)
● Plastic BGA (ZJZ)
● Temperature Options:
● A: –40°C to 85°C (PGF, ZHH, ZJZ)
● S: –40°C to 125°C (PTP, ZJZ)
● Q: –40°C to 125°C (PTP, ZJZ)
Part 3D Model
