●The TPS65921 device is a highly integrated power-management circuit (IC) that supports the power and peripheral requirements of the OMAP application processors. The device contains power management, a universal serial bus (USB) high-speed (HS) transceiver, an analog-to-digital converter (ADC), a real-time clock (RTC), a keypad interface, and an embedded power control (EPC). The power portion of the device contains three buck converters, two controllable by a dedicated SmartReflex class-3 interface, multiple low-dropout (LDO) regulators, an EPC to manage the power-sequencing requirements of OMAP, and an RTC module. The USB module provides an HS 2.0 transceiver suitable for direct connection to the OMAP universal transceiver macrocell interface (UTMI) + low pin interface (ULPI) with an integrated charge pump (CP).
●The device also provides auxiliary modules: ADC, keypad interface, and general-purpose inputs/outputs (GPIOs) muxed with the JTAG functions. The keypad interface implements a built-in scanning algorithm to decode hardware-based key presses and to reduce software use, with multiple additional GPIOs that can be used as interrupts when they are configured as inputs.
● Three Step-Down Converters:
● Up to 1.2 A of Output Current for VDD1
● TPS65921B Supports VDD1 up to 1.2 A
● TPS65921B1 Supports VDD1 up to 1.4 A (Necessary for 1-GHz Operation)
● SmartReflex Dynamic Voltage Management
● 3.2-MHz Fixed Frequency Operation
● VIN Range from 2.7 to 4.5 V
● Typical 30 µA Quiescent per Converter
● Four General-Purpose Configurable LDOs:
● Dynamic Voltage Scaling
● 220-mA Maximum Current for One LDO
● VIN Range from 2.7 to 4.5 V
● 2 LDOs With Low Noise and High PSRR
● RTC With Alarm Wake-Up Mechanism
● Clock Management
● 32-kHz Crystal Oscillator
● Clock Slicer for 26, 19.2, and 38.4 MHz
● HF Clock Output Buffer
● USB:
● USB HS 2.0 Transceiver
● USB 1.3 OTG-Compliant
● 12-Bit ULPI 1.1 Interface
● USB Power Supply (5-V CP for VBUS)
● Control
● High-Speed I2C Interface
● All Resource Configurable by I2C
● Keypad Interface up to 8 × 8
● 10-Bit A/D Converter
● Hot-Die, Thermal Shutdown Protection
● µ
●BGA 120 Balls ZQZ
