UPA810TF Datasheet PDF - NEC

●DESCRIPTION

●The UPA810TF contains two NE856 NPN high frequency silicon bipolar chips. NEC"s new low profile TF package is ideal for all portable wireless applicatons where reducing compo nent height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.

●FEATURES

●• SMALL PACKAGE OUTLINE:

●  SOT-363 package measures just 2 mm x 1.25 mm

●• LOW HEIGHT PROFILE: Just 0.60 mm hight

●• HIGH COLLECTOR CURRENT: ICMAX = 100 mA