VF30100S-E3/4W Datasheet PDF - General Semiconductor

●Features:

● Trench MOS Schottky Technology

● Low Forward Voltage Drop, Low Power Losses

● High Efficiency Operation

● Low Thermal Resistance

● Meets MSL Level 1, Oer J-STD-020, LF Maximum Peak of 245°C (For TO-263AB Package)

● Solder Dip 260°C, 40 s (For TO-220AB, ITO-220AB and TO-262AA Package)

● Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

●Applications:

●For use in high frequency inverters, switching power supplies, freewheeling diodes, OR-ing diode, dc-to-dc converters and reverse battery protection.