Part 3D Model

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W25Q32FVSSIG Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Flash Memory

Case Package:

SOIC-8

Description:

Flash Serial-SPI 3V/3.3V 32Mbit 4M x 8Bit 8.5ns 8Pin SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q32FVSSIG Datasheet (99 Pages)

Pinout Diagram on7 Page 8 Page 10 Page 11 PageHot

Part Numbering System on96 Page

W25Q32FVSSIG Datasheet PDF (99 Pages)

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W25Q32FVSSIG Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

8 Pin

Case/Package

SOIC-8

Supply Current

20 mA

Access Time(Max)

8.5 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

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W25Q32FVSSIG Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Size-Height

1.8 mm

Operating Temperature

-40℃ ~ 85℃ (TA)

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W25Q32FVSSIG Environmental

W25Q32FVSSIG Function Overview

W25Q32FVSSIG Documents

W25Q32FVSSIG Datasheet

Winbond Electronics

99 Pages / 0.93 MByte

W25Q32FVSSIG Other Datasheet PDF

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W25Q32FVSSIG Features Description Parametrics

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97 Pages / 1.32 MByte

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