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W947D6HBHX5E Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

TFBGA-60

Description:

DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60Pin VFBGA

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W947D6HBHX5E Datasheet PDF (16 Pages)

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W947D6HBHX5E Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

60 Pin

Case/Package

TFBGA-60

Clock Speed

200 MHz

Number of Bits

16 Bit

Access Time

5 ns

Access Time(Max)

5ns, 6.5ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-25 ℃

Supply Voltage

1.7V ~ 1.95V

W947D6HBHX5E Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-25℃ ~ 85℃

W947D6HBHX5E Environmental

W947D6HBHX5E Function Overview

W947D6HBHX5E Documents

W947D6HBHX5E Other Datasheet PDF

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16 Pages / 0.31 MByte

W947D6HBHX5E Features Description Parametrics

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60 Pages / 1.13 MByte

W947D6HBHX5 Documents

W947D6HBHX5I Datasheet PDF

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DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60Pin VFBGA

W947D6HBHX5E Datasheet PDF

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DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60Pin VFBGA

W947D6HBHX5I TR Datasheet PDF

Winbond Electronics

DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60Pin VFBGA

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