Part 3D Model

$ 3045.38

XC7Z100-1FFG1156I Datasheet PDF - Xilinx

Manufacturer:

Xilinx

Category:

Microprocessors

Case Package:

BBGA-1156

Description:

MPU Zynq-7000 RISC 32Bit 667MHz 1.5V/2V/2.5V 1156Pin F-BGA

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

XC7Z100-1FFG1156I User Reference Manual Guide (80 Pages)XC7Z100-1FFG1156I Programming Manual (85 Pages)

XC7Z100-1FFG1156I Datasheet PDF (80 Pages)

View Datasheet

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XC7Z100-1FFG1156I Specifications

TYPE

DESCRIPTION

Number of Pins

1156 Pin

Case/Package

BBGA-1156

RAM Memory Size

256 KB

XC7Z100-1FFG1156I Size & Package

TYPE

DESCRIPTION

Packaging

Tray

Operating Temperature

-40℃ ~ 100℃ (TJ)

XC7Z100-1FFG1156I Environmental

XC7Z100-1FFG1156I Documents

XC7Z100-1FFG1156I User Reference Manual Guide

Xilinx

80 Pages / 2.65 MByte

XC7Z100-1FFG1156I Programming Manual

Xilinx

85 Pages / 2.68 MByte

XC7Z100-1FFG1156I Notice File

Xilinx

5 Pages / 0.06 MByte

XC7Z1001FFG1156 Documents

XC7Z100-1FFG1156I Datasheet PDF

Xilinx

MPU Zynq-7000 RISC 32Bit 667MHz 1.5V/2V/2.5V 1156Pin F-BGA

XC7Z100-1FFG1156C Datasheet PDF

Xilinx

MPU Zynq-7000 RISC 32Bit 667MHz 1.5V/2V/2.5V 1156Pin F-BGA

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