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MPC5554 Datasheet PDF

Part Series:
MPC5554 Series
Category:
32 Bit Microcontroller
Description:
MCU 32Bit e200 RISC 2Mb Flash 1.8V/2.5V/3.3V/5V Automotive 416Pin BGA Tray
Updated Time: 2023/01/13 02:08:56 (UTC + 8)

MPC5554 Datasheet PDF 32 Bit Microcontroller

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MCU 32Bit MPC55xx e200 RISC 2048KB Flash 1.8V/2.5V/3.3V/5V 416Pin BGA Tray

MPC5554MZP132 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Frequency
132 MHz
Number of Pins
416 Pin
Supply Voltage (DC)
1.35V (min)
Case/Package
BGA-416
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MPC5554MZP132 Function Overview

Overview
The MPC5554 MCU enables complex, real-time control for engine management systems. It offers system performance of up to five times that of its MPC500 predecessors along with the reliability and familiarity of proven Power Architecture® technology.
Reduces costs by integrating more functionality on-chip
Development support speeds time-to-market
Supports multiple protocols and customer requirements through intelligent subsystems
Offers a migration path from the MPC500 MCUs, facilitating reuse of legacy software architectures
MoreLess
## Features
### Our e200z6 Core
High-performance 132 MHz 32-bit core built on Power Architecture technology
Memory management unit (MMU) with 32-entry fully associative translation lookaside buffer (TLB)
SPE (signal processing extension): DSP, SIMD and floating point capabilities
### Memory
2 MB of embedded flash memory with error correction coding (ECC) and read while write (RWW) capability
64 KB on-chip static RAM with ECC
32 KB of cache (with line-locking) that can be configured as additional RAM
### System
Two enhanced time processor units (eTPUs) with 64 I/O channels and 19 KB of designated SRAM
64-channel enhanced direct memory access (eDMA) controller
Interrupt controller (INTC) capable of handling 286 selectable-priority interrupt sources
Frequency modulated phase-locked loop (FMPLL) to assist in electromagnetic interference (EMI) management
MPC500 compatible external bus interface
Nexus IEEE®-ISTO 5001 class 3+ multicore debug capabilities
5/3.3V IO, 5V ADC, 3.3V/1.8V bus, 1.5V core
416-pin plastic ball grid array (PBGA) package
Temperature range: -40ºC to 125ºC
Optional temperature range: -55ºC to 125ºC
### I/O
40-channel dual enhanced queued analog-to-digital converter—up to 12-bit resolution and up to 1.25 ms conversions, six queues with triggering and DMA support
Four deserial serial peripheral
Interface (DSPI) modules—16 bits wide, up to six chip selects each
Three controller area network (CAN) modules with 64 buffers each
Two enhanced serial communication interface modules
### Development Tools
A comprehensive suite of hardware and software development tools is available to help simplify and speed system design
Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments
### Included in NXP ®.s product longevity program
Product longevity program with assured supply for a minimum of 15 years after launch
Product longevity program with assured supply for a minimum of 15 years after launch
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