Part 3D Model

$ 3.73

W971GG6KB-18 Application Note - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

TFBGA-84

Description:

IC DDR2 SDRAM 1GBIT 1.875NS BGA

Pictures:

3D Model

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Pinout Diagram onP1Hot

Package Outline Dimension onP21

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Electrical Specification onP2P3

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87 Pages / 1.26 MByte

W971GG6KB-18 Application Note

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