Part 3D Model

$ 0.253

B82498F3680J1 Datasheet PDF - Epcos

Manufacturer:

Epcos

Category:

Single Inductors

Case Package:

0805

Description:

Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive T/R

Pictures:

3D Model

Symbol

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Documentation:

B82498F3680J1 Datasheet (10 Pages)

Package Outline Dimension on3 Page

Part Numbering System on5 Page 6 Page

B82498F3680J1 Datasheet PDF (10 Pages)

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B82498F3680J1 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Case/Package (SI)

2012

Case/Package

0805

Inductance

68 nH

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

55 ℃

Resistance (DC Max)

6 Ω

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B82498F3680J1 Size & Package

TYPE

DESCRIPTION

Packaging

Tape & Reel (TR)

Size-Length

2 mm

Size-Width

1.25 mm

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B82498F3680J1 Environmental

B82498F3680J1 Documents

B82498F3680J1 Datasheet

Epcos

10 Pages / 0.48 MByte

B82498F3680J1 Other Datasheet PDF

Epcos

10 Pages / 0.16 MByte

B82498F3680 Documents

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Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive T/R

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TDK-EPC

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TDK

0805 68nH ±5% 500mA

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TDK

0805 68nH ±5% 500mA

B82498F3680J Datasheet PDF

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Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive T/R

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B82498F3680J1 Datasheet PDF

Epcos

Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive T/R

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