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Part Datasheet Search > IGBTs > ST Microelectronics > STGB30H60DF Datasheet PDF
STGB30H60DF
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STGB30H60DF Datasheet PDF (24 Pages)
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STGB30H60DF Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
3 Pin
Case/Package
TO-263-3
Power Dissipation
150000 mW
Breakdown Voltage (Collector to Emitter)
600 V
Reverse recovery time
110 ns
Input Power (Max)
260 W
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-40 ℃
Power Dissipation (Max)
150000 mW

STGB30H60DF Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Operating Temperature
-40℃ ~ 175℃ (TJ)

STGB30H60DF Documents

ST Microelectronics
24 Pages / 1.89 MByte

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