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Part Datasheet Search > IGBTs > ST Microelectronics > STGB30H60DLFB Datasheet PDF
STGB30H60DLFB
$ 3

STGB30H60DLFB Datasheet PDF - ST Microelectronics

Manufacturer:
ST Microelectronics
Category:
IGBTs
Case Package:
TO-263-3
Description:
Trans IGBT Chip N-CH 600V 60A 260000mW 3Pin(2+Tab) D2PAK T/R
Pictures:
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Product Pictures
Documentation:
STGB30H60DLFB Datasheet (20 Pages)
Package Outline Dimension on12 Page13 Page14 Page15 Page16 Page
STGB30H60DLFB User Reference Manual Guide (51 Pages)STGB30H60DLFB Application Note (35 Pages)
STGB30H60DLFB Datasheet PDF (20 Pages)
View Datasheet
Click page to view the detail

STGB30H60DLFB Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
3 Pin
Case/Package
TO-263-3
Power Dissipation
260000 mW
Breakdown Voltage (Collector to Emitter)
600 V
Input Power (Max)
260 W
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
260000 mW
View Datasheet >

STGB30H60DLFB Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Operating Temperature
-55℃ ~ 175℃ (TJ)
View Datasheet >

STGB30H60DLFB Documents

STGB30H60DLFB Datasheet
ST Microelectronics
20 Pages / 1.69 MByte
STGB30H60DLFB User Reference Manual Guide
ST Microelectronics
51 Pages / 2.12 MByte
STGB30H60DLFB Application Note
ST Microelectronics
35 Pages / 2.4 MByte

STGB30H60 Documents

STGB30H60DFB Datasheet PDF
ST Microelectronics
Trans IGBT Chip N-CH 600V 60A 260000mW 3Pin(2+Tab) D2PAK T/R
STGB30H60DLFB Datasheet PDF
ST Microelectronics
Trans IGBT Chip N-CH 600V 60A 260000mW 3Pin(2+Tab) D2PAK T/R
STGB30H60DF Datasheet PDF
ST Microelectronics
Trans IGBT Chip N-CH 600V 60A 150000mW 3Pin(2+Tab) D2PAK T/R
STGB30H60DLLFBAG Datasheet PDF
ST Microelectronics
600V, 30A high speed trench gate field-stop IGBT
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