Part 3D Model

$ 593.094

XCZU4EG-1FBVB900I User Reference Manual Guide - Xilinx

Manufacturer:

Xilinx

Case Package:

FCBGA-900

Description:

FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.9V 900Pin

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Pages guide:

Pinout Diagram onP13P14P15P16P17Hot

Package Outline Dimension onP71P124P125P126P127

Marking Information onP135P136P159

Packaging Infomation onP1P6P7P8P9

Soldering Temperature onP138P139P140P141

Specifications onP8P71P74P122P144

Application Area onP160

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XCZU4EG-1FBVB900I Documents

XCZU4EG-1FBVB900I Datasheet

Xilinx

107 Pages / 1.35 MByte

XCZU4EG-1FBVB900I User Reference Manual Guide

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160 Pages / 9.28 MByte

XCZU4EG-1FBVB900I Other Datasheet PDF

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13 Pages / 0.21 MByte

XCZU4EG-1FBVB900I Features Description Parametrics

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41 Pages / 1.2 MByte

XCZU4EG1FBVB900 Documents

XCZU4EG-1FBVB900E Datasheet PDF

Xilinx

Microprocessor Circuit, CMOS, PBGA900, 31 X 31MM, 1MM PITCH, ROHS COMPLIANT, FLIPCHIP-900

XCZU4EG-1FBVB900I Datasheet PDF

Xilinx

FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.9V 900Pin

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